To maximise efficiencies and continue to promote a seamless payment experience, EMV 3DS 2.3.1 is effective immediately and replaces EMV 3DS 2.3.0.

Key enhancements in EMV 3DS 2.3.1 include:

• New data elements to support Secure Payment Confirmation (SPC), that issuers and merchants can use within the EMV 3DS flow to better determine the legitimacy of a transaction in order to reduce the risk of fraud.

• New data elements to support out-of-band (OOB) authentication, which offers a simpler, easier-to-use way for consumers to confirm a transaction when an authentication method through a separate channel is required.

• User interface (UI) enhancements to enrich the user experience and additional features to improve the functionality of server components.

• New data elements and flows to enhance the options for the challenge process, an additional authentication step required for higher risk transactions.

EMVCo has also developed an EMV 3DS Bridging Message Extension that enables current 2.1 and 2.2 products to utilise selected features introduced in version 2.3.1.

“Rich data and flexible authentication methods can help issuers and merchants better determine the legitimacy of a transaction, reduce the risk of fraud and improve the payment experience for consumers. Working with EMVCo Associates and Subscribers, FIDO Alliance and the World Wide Web Consortium (W3C), we identified an opportunity to further enhance the EMV 3DS Specifications with version 2.3.1 to help issuers and merchants mitigate card-not-present (CNP) fraud and increase the security of online payments,” said Alisa Ellis, EMVCo Executive Committee Chair. “EMV 3DS 2.3.1 is just the latest example of how collaboration with the payments community is key to the ongoing evolution of EMV Specifications that support innovation and address marketplace needs.”

The EMV 3DS Specifications are available on the EMVCo website and include the EMV® 3-D Secure—Protocol and Core Functions Specification, the EMV® 3-D Secure—SDK Device Information, the EMV® 3-D Secure—SDK Specification, and the EMV® 3-D Secure—Split-SDK Specification.